Bond Alignment System
EVB 620 NT

Bidding
€85,000
Year of construction
2022
Condition
Used
Location
Suhl Germany
Bond Alignment System EVB 620 NT
Bond Alignment System EVB 620 NT
Bond Alignment System EVB 620 NT
Bond Alignment System EVB 620 NT
Bond Alignment System EVB 620 NT
Bond Alignment System EVB 620 NT
EVB 620 NT
EVB 620 NT
EVB 620 NT
EVB 620 NT
EVB 620 NT
EVB 620 NT
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Machine data

Machine type:
Bond Alignment System
Manufacturer:
EVB
Model:
620 NT
Machine number:
S220193
Year of construction:
2022
Condition:
used

Price & Location

Price:
€85,000
Auction start:
21.10.2025 at 11:00 o'clock
Auction end:
26.11.2025 at 11:15 o'clock

Location:
Am Mittelrain 11, 98529 Suhl Germany
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Details about the offer

Listing ID:
A20356320
Reference number:
376/3
Update:
23.10.2025

Description

Wafer alignment system, max. wafer size 150 mm, max. wafer thickness 4.4 mm, with optical alignment module, underside microscope and CCD camera, as well as rack unit. NOTE: The system is in like-new condition and has not yet been used in production!
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Registered since: 2017

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