Connection System / Wafer Bonding System
EVB 520 IS

Bidding
€1,15,000
Year of construction
2022
Condition
Used
Location
Suhl Germany
Connection System / Wafer Bonding System EVB 520 IS
Connection System / Wafer Bonding System EVB 520 IS
Connection System / Wafer Bonding System EVB 520 IS
Connection System / Wafer Bonding System EVB 520 IS
Connection System / Wafer Bonding System EVB 520 IS
Connection System / Wafer Bonding System EVB 520 IS
EVB 520 IS
EVB 520 IS
EVB 520 IS
EVB 520 IS
EVB 520 IS
EVB 520 IS
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Machine data

Machine type:
Connection System / Wafer Bonding System
Manufacturer:
EVB
Model:
520 IS
Machine number:
S220191
Year of construction:
2022
Condition:
used

Price & Location

Price:
€1,15,000
Auction start:
21.10.2025 at 11:00 o'clock
Auction end:
26.11.2025 at 11:20 o'clock

Location:
Am Mittelrain 11, 98529 Suhl Germany
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Details about the offer

Listing ID:
A20356315
Reference number:
376/4
Update:
23.10.2025

Description

Alignment system for wafers, max. wafer size 150 mm, max. wafer thickness 4.4 mm, manual loading and unloading, external cooling system by SMC, with process analysis recording, bonding module for UV light, bond cover for UV-LED curing, vacuum system with external vacuum pump and rack unit. NOTE: The equipment is as new and has not yet been used in production!
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Registered since: 2017

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