2017 Cleveland G-APU 5Cleveland
G-APU 5
2017 Cleveland G-APU 5
Cleveland
G-APU 5
Year of construction
2017
Condition
Used
Location
Cloppenburg 

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Machine data
- Machine type:
- 2017 Cleveland G-APU 5
- Manufacturer:
- Cleveland
- Model:
- G-APU 5
- Year of construction:
- 2017
- Condition:
- used
Price & Location
- Location:
- Cloppenburg, Germany

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Details about the offer
- Listing ID:
- A21824433
- Reference number:
- M02291
- Update:
- 30.04.2026
Description
Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels.
Accessories:
Total enclosure,
Camera system with 7x motorized zoom video system, plus 10x digital zoom
Extraction system 4000/3 D 240 3kW 630 m³/h
Swivel unit for package dressing
Grinding spindle SK 40
Grinding wheel guard, swivels to the rear
Software for converting DXF files to CNC files on PC
Single-disc width: 30 mm
Swivel axis: swivel plate for swivel angle: +/- 95 degrees
Delivery axis travel: 82 mm
Bedpfxey Ia Svs Ak Hswl
Oscillation hub : 83 mm
Spindle mounting diameter: 60 mm
DIA/CBN wheel flange hole: 32 mm
Speed of silicon wafer: 700 - 2800 rpm
SIC Grinding Spindle: 60 mm Ø
Workpiece clamping X-axis travel: 185 mm
Y-axis travel: 194 mm
Workpiece spindle head holder diameter : 100 mm
with belt spindle diameter : 100 x 200 mm
Grinding wheel balance: max. 40 kg
Workpiece spindle speed: 500 - 1500 rpm
SIC discs up to max.: 200 x 20 mm x 32 mm
Connected load: approx. 2.5 kW (400 Volts / 50 Hz)
Dimensions W x D x H: 2700 x 2200 x 2200 mm
colour: Grey
weight: 1900 kg
Diamond- / CBN grinding wheel diameter: 400 mm
Accessories:
Total enclosure,
Camera system with 7x motorized zoom video system, plus 10x digital zoom
Extraction system 4000/3 D 240 3kW 630 m³/h
Swivel unit for package dressing
Grinding spindle SK 40
Grinding wheel guard, swivels to the rear
Software for converting DXF files to CNC files on PC
Single-disc width: 30 mm
Swivel axis: swivel plate for swivel angle: +/- 95 degrees
Delivery axis travel: 82 mm
Bedpfxey Ia Svs Ak Hswl
Oscillation hub : 83 mm
Spindle mounting diameter: 60 mm
DIA/CBN wheel flange hole: 32 mm
Speed of silicon wafer: 700 - 2800 rpm
SIC Grinding Spindle: 60 mm Ø
Workpiece clamping X-axis travel: 185 mm
Y-axis travel: 194 mm
Workpiece spindle head holder diameter : 100 mm
with belt spindle diameter : 100 x 200 mm
Grinding wheel balance: max. 40 kg
Workpiece spindle speed: 500 - 1500 rpm
SIC discs up to max.: 200 x 20 mm x 32 mm
Connected load: approx. 2.5 kW (400 Volts / 50 Hz)
Dimensions W x D x H: 2700 x 2200 x 2200 mm
colour: Grey
weight: 1900 kg
Diamond- / CBN grinding wheel diameter: 400 mm
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